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Author's
Schedule
| Deadline
for submission of papers |
May 16, 2006
May
31, 2006 |
| Proposals
for half or full-day tutorials,
special sessions |
May 16, 2006
May
31, 2006 |
| Special Session paper submission
deadline |
June 15, 2006 |
| Notification
of acceptance |
July 28, 2006 |
| Deadline
for camera-ready copies |
September 15,
2006 |
| Copyright
forms due |
September 15,
2006 |
|
|
The
13th
IEEE International Conference on Electronics, Circuits and Systems
(ICECS 2006)
will be held in Nice, Côte d’Azur, France
on December 10-13,
2006.
Diverse backgrounds, striking contrasts, abundant natural and cultural
heritage
- these are the charms the French Riviera has to offer.
The
conference will be co-organized by the University of Bordeaux, the Ecole Polytechnique
of Montréal, the University
of Nice and the University of Metz.
ICECS is
a
major international forum presenting design methodologies, techniques
and
experimental results in emerging electronics, circuits and systems
topics.
ICECS 2006 will include tutorials, regular sessions (lecture and
poster),
special sessions and exhibitions.
Prospective authors
are
invited to submit their manuscripts reporting original work, as well as
proposals for special sessions and tutorials, in all areas of
electronics, circuits and sytems.
A special issue
consisting of the best presented papers will be published with Springer
Science & Business Media in the Analog Integrated
Circuits and Signal Processing International Journal. Authors of
the Best papers will be invited to submit a full version, with more
concentration on experimental results.
Topics
of Interest
Topics
include, but are not limited to, the following :
|
-
Analog Circuits and Signal Processing
|
-
Sensing and Sensor Networks
|
|
-
Digital Circuits and Signal Processing
|
-
Telecommunications and Multimedia
|
|
-
RF and Wireless Circuits & Systems
|
-
Photonic and Optoelectronic Circuits
|
|
-
Biomedical Circuits & Systems
|
-
Test and Reliability
|
|
-
System Architectures and Applications
|
-
Neural Network Circuits & Systems
|
|
- System
Integration (SoC, Mixed-Signal)
|
-
Heterogeneous Structures (HV, MEMS,...)
|
|
-
Assembly and Packaging (SiP & Flip-Chip)
|
-
Advanced Technologies (Nano, BAW,…)
|
For more information please contact:
General
Chairs: Eric
Kerhervé
IXL-FRANCE
Kerherve@ixl.fr
Mohamad Sawan
Ecole Polytechnique of Montreal-CANADA
mohamad.sawan@polymtl.ca
|
